|
| Abstract No.: |
|
| Title: |
Microwave joining of copper and its characterization
|
|
| Authors: |
Srinath Sri / Indian Institute of Technology Roorkee, India
Apurbbu Kumar Sharma / Indian Institute of Technology Roorkee, India
Pradeep Kumar/ Indian Institute of Technology Roorkee, India
|
|
| Abstract: |
Microwave materials processing can give an alternative to high energy consumption resistance heating technique that are commonly used in industries. In the present paper the joining of copper through microwave irradiation and characterisation of the joints has been reported. Copper in bulk form was used as specimen to be joined, which is otherwise very difficult to join through available technique due to its higher thermal conductivity. Joining process has been carried out using home microwave applicator at 2.45GHz and 900w. Principle of microwave hybrid heating was effectively employed using a susceptor medium so as to initiate microwave coupling with the metals. Joints has been characterised through scanning electron microscopy (SEM), X-ray diffraction (XRD), microhardness and porosity measurement. The porosity of joint area was observed to be 1.92% which is less when compared to TIG welding. Initial observations reveal effective metallurgical bonding between the surfaces to be joined. Detailed characterisation of the joints is underway.
|
|