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2237 |
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Effect of directional re-solidification on thermal plasma spray silicon depositions |
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Damon Jackson* / Plasma Base, USA Reed Patterson / Senergen Devices, USA Matt Suda/ Senergen Devices, USA Mike Sereda/ Senergen Devices, USA Robert Gansert/ AMTS, USA |
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Thermal plasma spray of silicon has large potential for economic impact in the semiconducting and solar power industries. By post processing a thermally sprayed silicon deposition using directional re-solidification, impurities in the substrate can be controlled. We used a Thermach gun and powder feeder (SG100 and AT-1200, respectively, Appleton, WI), to deposit silicon onto 4?x4?x3/16? steel samples. These samples were then heat treated up to their melting point using a combination of optical heat lamps and a collimated arc lamp. The depth and microstructure of the melted region was analyzed through imaging of the cross-sectioned samples. Directional re-solidification also had an effect on the impurity concentration along the sample. Control of impurities is demonstrated through this heat treatment and analyzed using SIMS and Laser Ablated ICP-MS. Understanding and controlling the impurity concentration has important implications in producing coatings in the solar industry as well as wafer processing equipment in the semiconducting industry. |