Abstract No.:	1011
Scheduled at:	Poster Presentation Grundlagen des Lötens Fundamentals of brazing
Title:	Investigation of Joining-ability of Sn-Zn alloy
Authors:	Yasuyuki Miyazawa / Tokai University, JAPAN Binh Duong Ngoc / UNIVERSITY SAINS MALAYSIA, MALAYSIA Masahiro NAITO/ Tokai University, JAPAN Tadashi SAWAMURA/ NIHON ALMIT CO., LTD., JAPAN Yasuyuki MIYAZAWA/ Tokai University, JAPAN Tadashi ARIGA/ Tokai University, JAPAN
Abstract:	Joining-ability of Sn-Zn alloy to copper base metal was investigated by spreading test, wetting balance test and observation examinations with SEM. And characteristics of wetting curves given from wetting balance test were estimated deeply. Electroplated copper thin plate with gold thin film was employed as base materials in this study. And especially elemental additional effect of Al, Si and so on into Sn-Zn alloys was investigated. Finally optimum compositions Sn-Zn-additional elements and optimum joining conditions were obtained according to this project results.

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