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2639 |
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Manufacture and properties of cold spray deposited large thickness Cu coating material for sputtering target |
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Kee-Ahn Lee / School of Advanced Materials Engineering Andong National University, South Korea Jin-hyeon Cho / Andong National University, Korea Young-Min Jin/ Andong National University, Korea Dong-Yong Park/ Tae-Kwang Tech., Korea Hyung-Jun Kim/ RIST, Korea Ik-Hyun Oh/ KITECH, Korea |
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This study attempted to manufacture a large thickness Cu coating layer as sputtering target material via a cold spray coating process. The microstructure and properties of the layer of Cu as sputtering target material (before and after annealing heat treatment) were evaluated, compared, and analyzed. To evaluate the purity, density, grain size, and uniformity, microstructure, and properties of the Cu-coated layer as sputtering target, X-ray diffraction, ICP analysis, SEM, EBSD, porosity analysis, and Vickers hardness test were performed. The result of observation of the layers purity and microstructure showed that a purity level (99.47%) similar to that of early powder 2N5 was maintained, and that the manufacture of cold spray deposited, a thick ~20 mm Cu coating material for sputtering target was successfully performed. As a result of EBSD mapping, the average grain size near the interface and around the center measured 1.48 ¼m and 1.49 ¼m; they were small and non-uniform compared to the 1.91 ¼m near the surface. Note, however, that recrystallization and grain growth (caused by annealing) increased the grain size to 1.82 ¼m (near the interface), 1.83 ¼m (near the center), and 1.87 ¼m (near the surface) and improved the uniformity level. Moreover, by post heat treatment, overall porosity declined (0.44% porosity/400oC-1hr. heat-treated), and grain texture became uniform. The possibility of controlling the microstructure as large thickness sputtering target by conducting annealing heat treatment was also confirmed. Nonetheless, the differences in porosity and hardness associated with coating thickness changes were maintained in part. Based on the aforementioned findings, this study suggests that using cold spray deposition, large thickness Cu-coating layers as sputtering target is practically applicable. |