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| Abstract No.: |
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| Title: |
Investigating the obstacle to the interfacial bonding of inconel 718 fabricated by kinetic spray process
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| Authors: |
Jaeick Kim* / Hanyangn University, Korea
S. Lee / Hanyang University, Republic of Korea
C. Lee/ Hanyang University, Republic of Korea
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| Abstract: |
A development of repairing technology using kinetic spray process can be very helpful for reducing the maintenance cost in plant industry. However, it is very difficult to produce fine INCONEL 718 layer possessing high interfacial bond strength via kinetic spray process. Thus, INCONEL 718 was deposited on SCM 440 and the interfacial properties were investigated, in order to investigate the obstacle to the bonding between INCONEL 718 layer and SCM 440 substrate. As a result, it was revealed that the dominant obstacle to the interfacial bonding was excessive degree of compressive residual stress accumulated in the coating layer. It was confirmed that adhesive bond strength of INCONEL 718 can be fairly improved only by low-temperature heat-treatment due to the relief of accumulated residual stress.
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