|
7295 |
|
Influence of the substrate properties on the cold gas spray deposition efficiency |
|
Vicente Albaladejo-Fuentes* / University of Barcelona, Spain Rodolpho Vaz / Thermal Spray Center (CPT), Dpt. Materials Science and Physical Chemistry, University of Barcelona, Spain Irene Garcia Cano/ Thermal Spray Center (CPT), Dpt. Materials Science and Physical Chemistry, University of Barcelona, Spain Javier Sánchez/ Thermal Spray Center (CPT), Dpt. Materials Science and Physical Chemistry, University of Barcelona, Spain A. Garfias/ , |
|
The Cold Gas Spray (CGS) is a thermal spray process capable, on the one hand, to produce thin or thick coatings, and on the other free-standing parts as a novel Additive Manufacturing (AM) technique. One of the main advantages of CGS is that minimally affects the raw material properties during the spraying, since it works at relatively low temperature, below the material recrystallization level. For AM application, the optimization of CGS parameters (working gas type, temperature, and pressure), deposition strategy (stand-off distance, velocity, and robot path), and selection of feedstock powder characteristics, is still a topic of interest for researchers. Among parameters to consider in CGS, substrate properties have an important role in the deposition of a coating or building up an AM component. It is generally accepted that hard materials are less suitable as substrates for CGS due to its low capability for plastic deformation upon powder particle impact. This work aims to present the trend of DE for various couples/pairs of cold sprayed material (Al, Cu, Ti, 316L stainless steel, and Inconel 625) and substrate material (Al, Cu, and 316L). Keeping constant the CGS parameters for all the tested materials, each powder was sprayed onto different substrates and the DE was measured. For results interpretation, the particle/substrate hardness relationship was calculated. In this evaluation was observed that the closer the particle/substrate hardness values, the higher the DE measured, which was associated to the reduction of adhesion by the significantly lower deformation of the substrate during particle impact. |