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817 |
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Tuesday, June 19, 2007, Brüssel 2:20 PM Fügen von Hartstoffen, Hartmetallen, Cermets Joining of cemented carbides, hard metals, cermets |
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Improvement of wettability and joint strength using Sn-In-Al-Si-V solder for diamond |
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Takahisa Yamazaki / Tokyo Institute of Technology, Japan Akio Suzumura / Tokyo Institute of Technology, Japan Toshi-Taka Ikeshoji/ Tokyo Institute of Technology, Japan Toru Ishiguro*/ Tokyo Institute of Technology, Japan Osamu Shimizu/ Komatsu co. ltd., Japan |
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For the precise polishing, joining a diamond to a polishing jig was tried and the soldered interface was investigated using an X-ray diffractometer to detect the reaction products and preference solidification in a surface modification of the diamond. If the joining the diamond to the metal-jig using a solder without the graphitization of the diamond is possible, a vacuum chamber in a joining process is not necessary and it is expected that the cracks at the joint interface between the metal- jig and the diamond by the thermal stress are not generated. Developed solder materials containing of not only a reactive metal of vanadium but also an Al-Si alloy are investigate to improve the wettability and the joint strength, since it is difficult to metallize the diamond surface at a low temperature under 720 K as the soldering temperature. In this study, aluminum element is considered to work important role to achieve soldering joint due to a small misfit of 2.30% with a vanadium carbide reactive product. These reaction products were formed at the soldered interface of diamond to achieve the joint strength. In the cases of the metallizings at the temperature range from 720 K to 870 K, the soldered joints of the diamonds were broken by about 1 MPa shear stress. In the case of the metallizing at higher temperature of 920 K, the shear strength becomes grater than 30 MPa. The 920 K metallizing process was carried out at near the melting point of Al. It indicates that another type of reaction products is formed at this process. |