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| Abstract No.: |
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Scheduled at:
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Friday, May 06, 2022, Hall G1 2:00 PM
Cold Gas Spraying IV
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| Title: |
Insights into the metallic particle bonding during cold spraying of polymeric substrates
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| Authors: |
Asghar Heydari Astaraee* / Politecnico di Milano, Italy
Sara Bagherifard / Politecnico di Milano, Italy
Chiara Colombo/ Politecnico di Milano, Italy
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| Abstract: |
Metallization of polymers using cold spray process is achieving wide consideration in recent years. The physical and mechanical properties of polymers are very sensitive to small changes in temperature. Thus, one of the critical parameters, which affects the first layer deposition and the quality of the coating is substrate thermal history during the cold spray deposition. This study aims to investigate numerically and experimentally the effects of particle velocity, particle temperature, and particle size and substrate thermal condition on the deformation behavior and bonding mechanisms in the metallization of PEEK polymer using copper powder feedstock. Experimental samples were prepared using a high pressure cold spray system to find the optimal processing parameters for successful deposition. A finite element model was developed to investigate the elastoplastic deformation behavior of a single copper particle impacting the PEEK substrate. The particle velocity and temperature were determined using the commercial Kinetics Spray Solutions software. Experimental wipe tests were designed and performed for model validation purposes. It was found that the substrate heating during cold spray may influnece particle bonding. The effects of particle velocity, particle temperature, and particle size on the deformation field and bonding mechanisms are discussed. The proposed model enables to tune the appropriate processing conditions for a successful adhesion.
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