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7151 |
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Wednesday, June 22, 2022, Saal Brüssel 9:40 AM Diffusion bonding |
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Recent developments in diffusion bonding - equipment and applications |
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Simon Jahn* / Günter-Köhler-Institut für Fügetechnik und Werkstoffprüfung, Germany Felix Gemse / ifw Jena, Germany |
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Since a few years, the joining technology diffusion bonding growth significant each year. Reasons for the intensified use nowadays are the capability to join large areas without any additional filler material and resulting high bond strength. The bond strength can be as high as the strength of base material for similar material joints. For corrosion resistance it is important to have everywhere the same material. The corrosion resistance is not reduced locally (compared to brazing). Beside the joint properties the recent developments in diffusion bonding equipment, e.g. better process control or higher precision, further contributes to the growth as well as the increasing available capacity at job shops. Due to changes in the general conditions, e.g. in society or political requirements, existing products must be adapted (e.g. scaled) or newly developed. Examples include mobility and energy use as well as the increased use of electronic devices. Diffusion bonded parts are applied in lithography systems for semiconductor production, for gas cooling during compression or to mold plastic parts for car interior. The contribution addresses the recent development in diffusion bonding equipment as well as applications of the solid state joining process. |