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1254 |
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Wednesday, June 04, 2008, Auditorium 2 12:20 PM Cold Spraying 2 Everything around this young thermal spraying technique, possible applications and latest developments for equipment of high pressure and low pressure cold spraying, models and simulations for a deeper process knowledge |
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Improvement in deposition efficiency of copper particle onto metallic substrate in cold spray process |
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Masahiro Fukumoto* / Toyohashi University of Technology, Japan Hiroki Terada/ Toyohashi University of Technology, Japan Kazunori Satoh/ Toyohashi University of Technology, Japan Masahiro Mashiko/ Toyohashi University of Technology, Japan Motohiro Yamada/ Toyohashi University of Technology, Japan |
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Copper porticles were deposited onto metallic substrate by normal cold spray equipment. By changing spray parameters, such as, nozzle design, working gas relating parameters, substrate relating parameters, improvement in deposition efficiency of copper particles and its optimization were tried. Thorugh the statistical experimental results, deposition mechanism of metal particle onto metallic substrate was verified in the present study. |