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| Abstract No.: |
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Scheduled at:
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Wednesday, September 28, 2011, Saal B2.1 12:15 PM
Alternative Power Generation
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| Title: |
Effect of directional re-solidification on thermal plasma spray silicon depositions
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| Authors: |
Damon Jackson / Plasma Base, USA
Mike Sereda / Solexant , USA
Robert Gansert*/ Advanced Materials and Technology Services, USA
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| Abstract: |
Thermal plasma spray of silicon has large potential for economic impact in the semiconductor and solar power industries. By post processing a thermally sprayed silicon deposition using directional re-solidification, impurities in the substrate can be controlled. We used a Thermach gun and powder feeder (SG100 and AT-1200, respectively, Appleton, WI), to deposit silicon onto 4 x4 x3/16 steel samples. These samples were optically heat treated up to their melting point in order to increase crystal grain sizes. The depth and microstructure of the melted region was analyzed through imaging of the cross-sectioned samples. Directional re-solidification also had an effect on the impurity concentration along the depth sample. Control of impurities is demonstrated through this heat treatment and analyzed using SIMS and Laser Ablated ICP-MS. Understanding and controlling the impurity concentration has important implications in producing coatings in the solar industry as well as wafer processing equipment in the semiconductor industry.
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