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4721 |
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Tuesday, May 10, 2016, Yellow River Hall 12:10 PM Novel Industrial Application |
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Investigation of influencing factors on the transplantation of wire arc sprayed Zn coatings for the metallization of plastic parts |
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Xifang Liao* / RWTH Aachen University, Germany Kirsten Bobzin / Surface Engineering Institute (IOT) at RWTH Aachen University, Germany Mehmet Öte/ Surface Engineering Institute (IOT) at RWTH Aachen University, Germany Thomas Frederik Linke/ Surface Engineering Institute (IOT) at RWTH Aachen University, Germany Christian Hopmann/ Institute of Plastics Processing (IKV) at RWTH Aachen University, Germany Philipp Ochotta/ Institute of Plastics Processing (IKV) at RWTH Aachen University, Germany |
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In a current study a new approach for the efficient production of metallized plastic parts which can be used for providing electric conductivity, electromagnetic shielding and decorative usage, the so called In-Mould-Metal-Spraying (IMMS), is being developed. A Zn coating is at first thermally sprayed onto mold cavity inserts (carrier body) by means of wire arc spraying and subsequently transferred onto a plastics carrier via injection molding. For a successful coating transplantation, among others finely adjusted bond strength between carrier body and coating is a key factor. In this study the influence of the carrier body and the surface pretreatment on the bond strength at the coating/carrier body interface and subsequently on the transferability of the coatings was investigated. Carrier bodies made of three different steel types, pretreated by glass bead blasting and electrical discharge machining (EDM), were tested. The surface topography was characterized by means of confocal laser scanning microscopy. In the first series of experiments, the hardnesses and surface topographies of the carrier bodies were identified as possible influencing factors of coating transferability. Further experiments focusing on the bond strength of the Zn coating to the hardened and tempered carrier bodies were carried out to verify the influence of carrier body hardness on the bond strength. |