| Abstract: |
Vacuum kinetic spray is a kind of spray coating technology that can be used to deposit ceramic materials at room temperature and has been considered to be suitable for applications in the field of piezoelectric, fuel cell, dye-sensitized solar cell, sensor, energy storage due to the rapid deposition rate of thin film. As the demand for miniaturization of application fields is increasing, the integration technology of circuits is also required. It is essential to form a high resolution pattern for this solution. However, the use of a mask is necessary to obtain a high resolution because of the thickness gradient of the film deposited by vacuum kinetic spray. In the present study the Al2O3 patterns with a high resolution were fabricated on Cu substrate by vacuum kinetic spray using different types of mask. For scale control of pattern resolution, two types of mask manufacturing method were selected. Laser-manufacturing method was used for the rapid and simple fabrication of the repeatable stainless steel mask. And photolithography method was used for the high resolution mask. For making the photolithography masks, cleaning, SU-8 2010 photoresist coating using spin-coater, soft-baking, exposure and developing process was used. HMDS solution was also deposited just before the photoresist coating using spin-coater for better adhesion. Optical microscope(OM), field emission scanning electronic microscope (FE-SEM) were used for microstructural analysis and surface profiler was used for the thickness measurement of the manufactured masks and patterns. The results indicated that both laser manufacturing and photolithography masks were well produced and the high resolution patterns were successfully fabricated on Cu substrate using vacuum kinetic spray. The pattern using photolithography mask showed better resolution than one using laser manufacturing mask.
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