Abstract No.:
5998

 Scheduled at:
Wednesday, May 22, 2019, Saal Brüssel 4:20 PM
Brazing of ceramic and glass


 Title:
Ceramic joining technology for thermoelectric modules

 Authors:
Axel Rost* / Fraunhofer IKTS, Germany
Daniel Zuckermann / Isabellenhütte, Germany
Mario Trache/ Fraunhofer IKTS, Germany
Jochen Schilm/ Fraunhofer IKTS, Germany

 Abstract:
The challenge in expanding the range for thermoelectric power generation to temperatures above 300 °C is not only an issue of materials for TE-legs but also for joining and interconnection technology. Replacing toxic bismuth telluride by much more environmental friendlier materials like Half-Heuslers, Silicides or non toxic materials like ceramics, results in a remarkable increase of exploitable temperatures of up 800 °C. Finding suited interconnection- and substrate-materials is difficult due to a couple of reasons like oxidation stability at elevated temperatures, matched coefficient of thermal expansion, mechanical stability or the ability of joining to TE-materials. A commonly applied solution for the hot side interconnection of Thermoelectric Generators (TEGs) are direct copper bonded alumina substrates (DCB) consisting of a sheet of copper, bonded on a ceramic substrate made of aluminium oxide. Beside the advantage of high temperature stability, notably of the ceramic component, this solution lacks on thermal cycleability and cost targets to be met. In the European project INTEGRAL, IKTS and Isabellenhütte are developing cost effective solutions for hot side interconnections based on cost effective technologies and materials. Results on new developed interconnections and assembly technology applying ceramics; metals and glass-ceramics are presented.

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